contact@sunumestore.com +90 (216) 483 9000

Sunum E-Store

Custom Dicing Service

Dicing is the process to separate the die in desired dimensions from a wafer precisely in an automated manner. Dicing saw contacts and move across the wafer to make a scratch with pre-defined parameters depending on the blade and substrate parameters.

SUNUM offers dicing services on various wafers diameters ranging from a few mm to 150 mm. The system manages to dice the wafer into the desired pieces with a diamond blade rotating up to 30,000 RPM in a micrometer precision.

Sunum E-Store Sunum E-Store

Your cart is currently empty.