Dicing is the process to separate the die in desired dimensions from a wafer precisely in an automated manner. Dicing saw contacts and move across the wafer to make a scratch with pre-defined parameters depending on the blade and substrate parameters.
SUNUM offers dicing services on various wafers diameters ranging from a few mm to 150 mm. The system manages to dice the wafer into the desired pieces with a diamond blade rotating up to 30,000 RPM in a micrometer precision.
Please consult us for your questions and custom design services or further information.